Taconic 高频板材 高速数字信号背板 最常用的Taconic天线板材 - 高性能和经济性: Taconic基站天线板材 介电常数 基板: TLG-29 2.9 TLG-30 3.0 TSM-30 3.0 RF35 / RF35P 3.5 半固化片: fastRise(TM) 2.7 TacPreg TGP-30 3.0 TacPreg TGP-35 3.5 P请选择点击所需要的材料，观看并下载板材资料。 以下关于板材的深入资料可以在会员登陆区下载Members' Area : 详细的板材加工参数 板材安全资料 (MSDS) 板材防火安全资料 Taconic板材技术文章: ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials Signal-Integrity Measurements Support the Candidacy of PTFE at High Data Rates High Layer Count Backpanels Operating at 10 Gb/s Enabled by PTFE-based Composites PTFE-based Composites for High Speed Digital Designs A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications Taconic板材应用案例介绍: High Performance Economical Substrates - Myth or Reality? CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Effects of Surface Finish on HF Signal Loss Using Various Substrates The Use of PTFE Base Materials How PTFE can compete with the best in thermosets High Frequency Test Methods 在点击之间，您便可在Taconic技术资源中心寻找到所需要的技术资料。 回到产品总目录 Corporate Homepage | ©2007 by Taconic | Update: 08/10/2008