Taconic 高频板材
RF Multilayer
最常用的Taconic天线板材 - 高性能和经济性:
Taconic 基站天线板材
介电常数
基板:
TLG-29
2.9
TLG-30
3.0
RF-35
/
RF-35A
/
RF-35P
3.5
TSM-30
3.0
半固化片:
fastRise prepreg
2.7
TacPreg TGP prepreg family
3.0, 3.2, 3.5
TacBond HT1.5 bond film
2.35
请选择点击所需要的材料，观看并下载板材资料.
以下关于板材的深入资料可以在会员登陆区下载
Members' Area
of our home page
:
Detailed processing information
Material Safety Data Sheets (MSDS)
UL information
Taconic 板材技术文章:
ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
PTFE-based Composites for High Speed Digital Designs
A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications
Taconic 板材应用案例介绍:
Dielectric Constant Testing
The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines
High Performance Economical Substrates - Myth or Reality?
CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation
Effects of Surface Finish on HF Signal Loss Using Various Substrates
The Use of PTFE Base Materials
How PTFE can compete with the best in thermosets
High Frequency Test Methods
在点击之间，您便可在Taconic
Technical Resource Centre
寻找到所需要的技术资料。
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| ©2007 by Taconic | Update: 08/10/2008