Taconic 高频板材 RF Multilayer 最常用的Taconic天线板材 - 高性能和经济性: Taconic 基站天线板材 介电常数 基板: RF-35 / RF-35A2 / RF-35P 3.5 TSM-30 3.0 TSM-DS 2.85 TLC-32 3.2 半固化片: fastRise27 prepreg 2.7 TacPreg TGP prepreg family 3.0, 3.5 TacBond HT1.5 bond film 2.35 请选择点击所需要的材料，观看并下载板材资料. Taconic 板材技术文章: ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials PTFE-based Composites for High Speed Digital Designs A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications Taconic 板材应用案例介绍: Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures TSM-DS multilayer pcbs manufactured with various prepregs - fastrise27, HT1.5, Speedboard C, and FEP Overcoming Mechanical Drilling and Registration for High Layer Count RF and Digital PWBs Containing PTFE Dielectric Constant Testing Multilayer Lamination Methods for PTFE-Based PCBs Microwave Multilayer Printed Circuit Boards Hybrid Multilayer The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines High Performance Economical Substrates - Myth or Reality? CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Effects of Surface Finish on HF Signal Loss Using Various Substrates The Use of PTFE Base Materials High Frequency Test Methods 在点击之间，您便可在Taconic Technical Resource Centre 寻找到所需要的技术资料。 回到产品总目录 Corporate Homepage | ©2010 by Taconic | Update: 14/05/2012