Taconic 高频板材 无线链路 最常用的Taconic天线板材 - 高性能和高经济性: Taconic天线板材 介电常数 TSM-DS 2.85 RF-35A2 3.5 TLC 3.0, 3.2 TLX 2.50, 2.55 TLP 2.17, 2.20, 2.33 TLY 2.17, 2.20, 2.33 TacLamPLUS 2.10 Heavy metal backed laminates Taconic 更特别提供厚金属（紫铜，黄铜，铝）板材，为功放提供最理想的散热和接地表现。 请选择点击所需要的材料，观看并下载板材资料。. Taconic板材应用案例介绍: Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures TSM-DS multilayer pcbs manufactured with various prepregs - fastrise27, HT1.5, Speedboard C, and FEP Dielectric Constant Testing The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines PTFE Microwave Substrates - Mature Products for an Emerging A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications High Performance Economical Substrates - Myth or Reality? CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Effects of Surface Finish on HF Signal Loss Using Various Substrates The Use of PTFE Base Materials Hybrid Multilayer High Frequency Test Methods 在点击之间，您便可在Taconic技术资源中心寻找到所需要的技术资料。 回到产品总目录 Corporate Homepage | ©2010 by Taconic | Update: 14/05/2012