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RF-35P High-Speed Digital, RF & Microwave Laminate 射频微波板材
Characteristics
Thicknesses available ≥ 0.002" (0.05 mm)
Low Cost
Excellent Peel Strength
Exceptionally Low Loss
Low Moisture Absorption
Consistent Dimensional Stability
Very High Thermal Reliability
Applications
Multilayer
Power Amplifier, TMA, TMB
Filter, Coupler, Splitter, Combiner, Mixer
Antenna
Passive Components
High Speed Digital Backpanels
Introducing RF-35P
RF-35P is the best choice for low cost, high volume commercial microwave and radio
frequency applications. RF-35P has excellent peel strength for 1/2 ounce and 1 ounce
copper (even in comparison to standard epoxy materials), a critical aspect whenever
rework is required. RF-35P’s Tg is over 600ºF (315ºC). RF-35P’s ultra low moisture
absorption rate and low dissipation factor minimize phase shift with frequency.
RF-35P is dimensionally stable due to the use of woven fabrics in its design.
RF-35P yields exceptional electrical, mechanical and thermal performance for high
density, multi layer microwave and high speed digital circuits. RF-35P is constructed
with all fine weave glass, yielding exceptional machining quality. RF-35P laminates
are generally ordered clad on one or both sides with 1/2, and 1 oz. electrodeposited
copper. RF-35P laminates exhibit flammability of V-0, and are tested in accordance
with IPC-TM-650. A certificate of compliance containing lot specific test data
accompanies each shipment. Please continue for a complete product listing.
 典型值
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