TLG/TPG Laminates and Prepregs for High-Speed Digital and RF Multilayer 射频微波板材 Characteristics Bromine-free Enables manufacture of 20+ layer PWBs at FR-4 temperatures & pressures Foil laminations for controlled thickness RF Multilayers Alternative to thermoplastic films in military multilayer printed circuit boards Homogeneous laminates for high-speed data transmission Applications High-Speed Digital RF Multilayer Military Introducing TLG laminates/TPG prepregs for Multilayer The multilayer package TLG laminates/TPG prepregs was designed to reduce electrical loss and to improve ease of fabrication. TLG/TPG are based on BT/epoxy/woven fiberglass/PTFE components. TLG/TPG offer the following benefits to high speed designs due to the reduced dielectric constant: Faster signal propagation speed/reduced propagation delay Thinner cores reduce overall multilayer thickness Wider traces/thinner spacings between edge coupled pairs reduce crosstalk Attenuation is proportional to the square root of dielectric constant * frequency * dissipation factor TLG/TPG offer the following additional features: Reduced loss at higher frequencies resulting in lower rise-time degradation More uniform construction resulting in less dielectric variation within the prepreg and laminate Reduced z-axis expansion (less temperature dependent dielectric constant variation) Improved prepreg flow for buried and blind via applications where through holes are not desired Impedance variation along a 24" microstrip of +/- 0.5 ohms TLG/TPG have the following benefits standard to the TacPreg/TacLam family of products: Good copper adhesion on flat reverse treated foils The ability to laminate at conventional FR-4 temperatures enabling Taconic to offer these products with FR-4 like economies of scale TLG/TPG are dimensionally stable due to the woven glass design and show predictable movement when laminated at FR-4 conditions 典型值 下载PDF档案 下载相关加工建议 回到产品总目录 Corporate Homepage | ©2007 by Taconic | Update: 08/10/2008