TLG/TPG 典型值 RF Substrate TLG - 射频微波板材 Taconic Advanced Dielectric Division

TLG/TPG Laminates and Prepregs for High-Speed Digital and RF Multilayer 射频微波板材:
典型值

Property Units Typical Value Method

TLG-29 TPG-30

Dielectric Constant
(10GHz) 2.87 3.00 IPC-TM 650 2.5.5.5.1

Dissipation Factor
(10GHz) 0.0027 0.0038 IPC-TM 650 2.5.5.5.1

Peel Strength
1 oz ED copper
(CV1) lbs 13 IPC-TM 650 2.4.8

Peel Strength
1 oz reverse treated copper (CL1) lbs 7.0 IPC-TM 650 2.4.8

Moisture Absorption (%) 0.14 0.13 IPC-TM 650 2.6.2.1

Dielectric Breakdown kV 43 54 IPC-TM-650 2.5.6

Dielectric Strength V/mil 680 860 ASTM D 149

Volume Resistivity Mohm/cm 9.8 x 10⁷ 7.7 x 10⁸ IPC-TM 650 2.5.17.1 (Humidity Conditioning)

Surface Resistivity Mohm 8.8 x 10⁶ 1.1 x 10⁹ IPC-TM 650 2.5.17.1 (Humidity Conditioning)

Flexural Strength
(MD) psi 10,200 19,900 ASTM D 790

Flexural Strength
(CD) psi 8,800 14,900 ASTM D 790

Tensile Strength (MD) psi 5,600 12,700 ASTM D 3039

Tensile Strength (CD) psi 4,400 8,200 ASTM D 3039

Poisson's Ratio 0.26 0.22 ASTM D 3039

Dimensional Stability ppm (warp/fill) 86/108 98/99 IPC-TM 650 2.4.39
(after etch)

Density
(Specific Gravity) g/cm³ 2.07 2.02 ASTM D 792

Thermal Conductivity W/m/K 0.31 0.25 ASTM F 433

T300 minutes >60 IPC-TM 650 2.4.24.1

CTE
(x-y) ppm 21-23 ASTM D 3386 (30-100C)

CTE
(z) ppm 23 28 ASTM D 3386 (30-100C)

Flammability Rating V-0 UL94

The values for TacGreen TPG-30 and TPG-35 prepregs are similar to those of the TLG laminates.

How to order TLG Laminates/TPG Prepregs
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