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TacPreg™ TPG Family for High-Speed Digital and RF/Microwave Applications 射频微波板材
Features and Benefits
Fabrication at standard PWB temperatures and pressures
Enables manufacture of 20+ layer PWBs
Dissipation factor flat over frequency, enabler for 6.25 gigabits/second highspeed digital applications
Meets or exceeds industry standard peel strength requirements (IPC 4101/4103) on 0.5 oz reverse treated foils
Enhanced stiffness over standard PTFE-based laminates
| Property |
Units |
Typical Value |
Method |
Dielectric Constant
(10GHz) |
|
3.0; 3.2; 3.5 |
IPC-TM 650 2.5.5
Alexander Bereskin* |
Dissipation Factor
(10GHz) |
|
0.0038; 0.005; 0.005 |
IPC-TM 650 2.5.5.5
Alexander Bereskin* |
Peel Strength
1 oz reverse treated foil |
lbs |
7 |
IPC-TM 650 2.4.8 |
| Moisture Absorption |
(%) |
0.13; 0.22; 0.13 |
IPC-TM 650 2.6.2.1 |
| T300 |
min |
> 60 |
|
|
| *Alexander Bereskin Patents (5,083,088 and 5,187,443) |
TacPreg™ TPG35 loss chart above and TacPreg™ used to make a 20 layer back
panel. Eye pattern created at 6.25 gb/s on a 20" trace using Teradyne GBX connectors.
 Press Cycle
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