TPN No Flow Prepregs

特征
  • Low resin flow (1 - 7%)
  • Bromine -free high performance product line
  • BT/Epoxy/Woven fiberglass/PTFE Composite
  • Stable DK and loss over frequency
  • DK flat over temperature
  • Low Z-axis CTE

    应用
  • High-Speed Digital Multilayer
  • RF Multilayer
  • Military Multilayer

    Introducing TPN-30, TPN-32, TPN-33, TPN-35
    The TPN range of materials from Taconic AdvancedDielectric Division represent a new generation of low-loss, thermally-stable prepreg materials for low-loss multilayer PCBs. TPN is woven-glass reinforced for enhanced dimensional-stability and coupled with Taconic’s experience in ceramic technology, TPN Exhibits low and consistent Z-axis expansion across a wide range of temperature including and up to soldering conditions.


    数据表
    回到产品总目录


  • Corporate Homepage | ©2010 by Taconic | Update: 14/05/2012