需要更多资料，请与我们联络 Taconic 对线路板厂有用的相关板材加工建议 Please click on the link for detailed information. Dielectric Constant Testing Using PTFE-Based Laminates at High Temperatures Fusion Bonding Considerations for PTFE-based PCB Laminates CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Metalization of High Performance Resin Materials with a Graphite-Based Direct Plating System The Effects of Lead-Free Solder Finishes on Microwave Printed Circuit Board Performance Taconic WEEE and RoHS Compliance Statement Low Outgassing Characteristics of Taconic's Laminates for Spacecraft Applications Environmental Aspects of PTFE Based Laminates in Relation to "Halogen-Free" Plasma Processes for Printed Circuit Board Manufacturing PIM - Passive Intermodulation Precision Laser Cutting of PTFE Substrates for High Frequency Circuits Hybrid Multilayer Printed Circuit Boards Technology Transitions and the Comparative Properties Low Cost Materials PTFE and Hybrid Multilayer Bonding and Fabrication The Care and Handling of PTFE Laminates Solder Reflow "Sweat" Bonding Corporate Homepage | ©2007 by Taconic | Update: 11/11/2008