|
 |
|
  |
|
|
6323-01R Non-silicone Masking Tape
Eigenschaften
High performance non-silicone adhesive
High operating temperature range (above 260°C)
Removes cleanly without adhesive residue and contamination after exposure to heat
Thin and conformable, enabling masking of uneven surfaces
High strength backing provides superior resistance to puncture and tear
High resistance to chemical attack
No polysiloxane contamination after wave soldering process
Anwendungen
Cover layer material for many types of flexible printed circuit board processes, especially required to avoid low molecular weight polysiloxane contamination
High-temperature electrical applications in which a tough ，thin and solvent resistant insulating material is required for wrapping coils，transformers，capacitors and wire harnesses
6323-01R Non-silicone masking tape has 25μ (1 mil) polyimide backing with nonsilicone adhesive. The polyimide film provides superior dielectric performance and the best high temperature properties of all organic films. It is inherently flame resistant and stable
against most chemicals and solvents.
6323-01R is designed for numerous high temperature masking applications. 6323-01R has excellent adhesion and holding power
and it does not leave any contamination or adhesive residue after wavesoldering.
Tape Properties:
Peel Strength
(Adhesive) |
Breakdown
Voltage |
Substrate
Thickness |
Adhesive
Thickness |
| gf/25mm |
kV |
micron |
micron |
>400 |
>5.0 |
25 |
50 |
|
6323-01R Non-silicone masking tape is available in roll format. Please talk to our Customer Service staff for details.
 Datenblatt
Zurück zur Produktübersicht
|
|
|
|
|
|
|