| Property |
Units |
Typical Value |
Method |
| |
|
TLG-29 |
TLG-30 |
|
Dielectric Constant
(10GHz) |
|
2.87 |
3.00 |
IPC-TM 650 2.5.5.5.1
|
Dissipation Factor
(10GHz) |
|
0.0027 |
0.0038 |
IPC-TM 650 2.5.5.5.1
|
Peel Strength
1 oz ED copper
(CV1) |
lbs |
13 |
IPC-TM 650 2.4.8 |
Peel Strength
1 oz reverse treated copper (CL1) |
lbs |
7.0 |
IPC-TM 650 2.4.8 |
| Moisture Absorption |
(%) |
0.14 |
0.13 |
IPC-TM 650 2.6.2.1 |
| Dielectric Breakdown |
kV |
43 |
54 |
ASTM D 149 |
| Dielectric Strength |
V/mil |
680 |
860 |
ASTM D 149 |
| Volume Resistivity |
Mohm/cm |
9.8 x 107 |
7.7 x 108 |
IPC-TM 650 2.5.17.1 (Humidity Conditioning)
|
| Surface Resistivity |
Mohm |
8.8 x 106 |
1.1 x 109 |
IPC-TM 650 2.5.17.1 (Humidity Conditioning)
|
Flexural Strength
(MD) |
psi |
10,200 |
19,900 |
ASTM D 790 |
Flexural Strength
(CD) |
psi |
8,800 |
14,900 |
ASTM D 790 |
| Tensile Strength (MD) |
psi |
5,600 |
12,700 |
ASTM D 3039 |
| Tensile Strength (CD) |
psi |
4,400 |
8,200 |
ASTM D 3039 |
| Poisson's Ratio |
|
0.26 |
0.22 |
ASTM D 3039 |
| Dimensional Stability |
ppm (warp/fill) |
86/108 |
98/99 |
IPC-TM 650 2.4.39
(after etch) |
Density
(Specific Gravity) |
g/cm3 |
2.07 |
2.02 |
ASTM D 792 |
| Thermal Conductivity |
W/m/K |
0.31 |
0.25 |
ASTM F 433 |
| T300 |
minutes |
>60 |
IPC-TM 650 2.4.24.1 |
CTE
(x-y) |
ppm |
21-23 |
ASTM D 3386 (30-100C) |
CTE
(z) |
ppm |
23 |
28 |
ASTM D 3386 (30-100C) |
| Flammability Rating |
|
V-0 |
UL94 |
|