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Thin Dielectrics in PWB Techniques and its Possibilities for DCA and HDA
By introducing thin dielectrics new possibilities have been opened for the electronic packaging and interconnection.
Thin dielectrics have made it possible to produce small holes and still assure controlled plating. But there has been
also been opening more possibilities; photo via technology is more photo dielectric, which makes it possible to
attach different kind of dielectrics were you want to have it on the board. Even more: the thin dielectrics are
mostly unreinforced, which means that the thin layers are floating on the rigid centre carrier, which also opens
new possibilities. Buried chips will make denser packaging and Offset printing opens a fully depositing technology
with fewer waste products.
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