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GHz Flip Chip - An Overview
The drive in industry towards more and more wireless
communication for various purposes increases the need for
packaging for ever higher frequencies. This paper gives an
overview of recent activities, presented by companies and
universities, at GHz frequencies. The main topic is the chip
interconnect, and GaAs flip chip specifically.
The drive in industry towards more and more wireless
communication for various purposes increases the need for
packaging for ever higher frequencies. This paper gives an
overview of recent activities, presented by companies and
universities, at GHz frequencies. The main topic is the chip
interconnect, and GaAs flip chip specifically.
Papers are mostly concerned with chip design issues, and
simulations of various structures. The coplanar chip design
appears to be favored, along with non-melting bumps for
interconnect.
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