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A new, low loss laser-ablatable substrate for microwave circuitry
Taconic has developed a new non-reinforced thin-core laminate called TacLam PLUS. Using PWB manufacturing techniques it can be used to form mm-wave circuits allowing the formation of microwave components and is capable of accommodating MMICs and surface-mount devices. With 350°C laminating capability, multilayer structures are possible enabling greater circuit density, stripline componentry and shielding techniques.
TacLam PLUS represents a cost-effective microwave substrate that can be used to create very low loss structures both with single dielectric layers and multiple layers. Exceptional copper-foil adhesion allows small-feature resolution and the unique composition of the dielectric facilitates clean laser ablation for micro-via and component-cavity formation. The use of metal-backing, such as 1 mm copper, helps maintaining dimensional stability and provides both, a sound ground plane, and ideal heat-sinking properties.
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