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Taconic REACH Statement
The products supplied by Taconic are defined under the REACH legislative program as articles. None of the components of our products are intentionally released during the use of our products when they are used as intended and according to recommended specifications and parameters. Our products do not contain REACH SVHC materials in excess of 0.1% w/w as required by the REACH legislation.
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Taconic introduces fastRiseTM Multilayer Non-Reinforced Prepreg
fastRiseTM27 is designed to eliminate skew in differential transmission lines and eliminate dielectric constant fluctuations caused by fiberglass in filter and coupler applications. This low temperature thermosetting prepreg is based on ceramic, thermoset and PTFE and is ideal for use with Taconic's standard low loss laminates like TSM-29.
For applications that require low loss at high frequencies, fastRiseTM27 prepreg offers design engineers the properties needed for superior performance. The low 0.0017 Df at 40 GHz enables the production of mmWave multilayer PWBs. In addition, the low 420 F (215 ºC) lamination temperature enables sequential laminations to be performed at lower temperatures than those normally used for FEP and PFA in military constructions.
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Taconic Gets Flexible
Taconic introduces HyRelex, a family of low loss, high reliability, thin, flexible interconnect materials. HyRelex laminates can be used in conjunction with HyRelex bond-ply and cover-lay for a wide range of applications.
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Taconic's base materials are WEEE and RoHS compliant
WEEE (Waste Electrical and Electronic Equipment), a European advisory group, proposed a directive, which has recently been approved by the European Union (Direction 2002/96/EC), and is concerned with the recycling and recovery of Electrical and Electronic waste. This is translated into the RoHS (Restriction of Hazardous Substances) directive in each individual country and is complimentary to the WEEE.
Taconic can confirm that all products listed in the Taconic WEEE and RoHS Compliance Statement are in compliance with those directives.
TacLam PLUS - A new, low loss laser-ablatable substrate for microwave circuitry
Taconic has developed a new non-reinforced thin-core laminate called TacLam PLUS. Using PWB manufacturing
techniques it can be used to form mm-wave circuits allowing the formation of microwave components and is
capable of accommodating MMICs and surface-mount devices. With 350°C laminating capability, multilayer
structures are possible enabling greater circuit density, stripline componentry and shielding techniques.
TacLam PLUS represents a cost-effective microwave laminate that can be used to create very low loss structures
both with single dielectric layers and multiple layers. Exceptional copper-foil adhesion allows small-feature
resolution and the unique composition of the dielectric facilitates clean laser ablation for micro-via and
component-cavity formation. The use of metal-backing, such as 1 mm copper, helps maintaining dimensional
stability and provides both, a sound ground plane, and ideal heat-sinking properties. [more...]
Taconic Microwave Laminates are Bromine-free
Regulations introduced in Europe are driving E&E OEM's to move towards non-bromine containing base materials
and prepregs to produce printed circuit boards, although the regulations do not actually ban the FR4 materials.
A review of the regulations indicates that they do not constitute a ban of all materials that can be chemically
classified as containing a "halogen" in its broadest sense, but a move towards "bromine-free". PTFE based
materials are not included in any current or future regulatory guidelines or bans. The outstanding characteristics
of PTFE including thermal stability, flame resistance, electrical properties and durability of electrical
properties render this plastic as the top candidate for printed circuit boards.
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