Taconic Solution for your RF Multilayer Most used Taconic base materials for high performance and cost reductions: Taconic Grade Dielectric Constant Laminates: RF-35 / RF-35A2 / RF-35P 3.5 TSM-DS 2.85 TSM-29 & 30 2.94, 3.0 TLC-32 3.2 Prepregs: fastRise prepreg 2.7 TacPreg TGP prepreg family 3.0, 3.2, 3.5 TacBond HT1.5 bond film 2.35 Please click the Taconic Grade to view and/or download detailed base material information. This information is available in the Members' Area of our home page: Detailed processing information Material Safety Data Sheets (MSDS) UL information Case Studies using Taconic base materials: ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials PTFE-based Composites for High Speed Digital Designs A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications Application Notes of Taconic base materials: Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures TSM-DS multilayer pcbs manufactured with various prepregs - fastrise27, HT1.5, Speedboard C, and FEP Overcoming Mechanical Drilling and Registration for High Layer Count RF and Digital PWBs Containing PTFE Dielectric Constant Testing Multilayer Lamination Methods for PTFE-Based PCBs Microwave Multilayer Printed Circuit Boards Hybrid Multilayer The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines High Performance Economical Substrates - Myth or Reality? CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Effects of Surface Finish on HF Signal Loss Using Various Substrates The Use of PTFE Base Materials High Frequency Test Methods Taconic's Technical Resource Centre provides a wealth of technical information at a click of your mouse button. Back to Products Overview Corporate Homepage | ©2007 by Taconic | Update: 28/02/2010