Taconic Solution for your

Radio Link

Most used Taconic base materials for high performance and cost reductions:

Taconic Grade Dielectric Constant
TSM-DS 2.85
RF-35A2 3.5
TLC 3.0, 3.2
TLX 2.50, 2.55
TLP 2.17, 2.20, 2.33
TLY 2.17, 2.20, 2.33
TacLamPLUS 2.10
Heavy metal backed laminates Taconic also manufactures radio link base materials clad with thick copper, brass and aluminium for heat dissipation and grounding

Please click the Taconic Grade to view and/or download detailed base material information.

Application Notes of Taconic base materials:
Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures
TSM-DS multilayer pcbs manufactured with various prepregs - fastrise27, HT1.5, Speedboard C, and FEP
Dielectric Constant Testing
The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines
TacLamPLUS - A Low Cost, Very Low Loss PCB Substrate for mmWave Applications
A new, low loss laser-ablatable substrate for microwave circuitry base material solutions for mmWave automotive applications
Novel Module Architectures up to 50 GHz - SMT and RF-Boards
A New Low Loss, Laser Ablatable Substrate for Microwave Circuitry
PTFE Microwave Substrates - Mature Products for an Emerging
A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications
High Performance Economical Substrates - Myth or Reality?
CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation
Effects of Surface Finish on HF Signal Loss Using Various Substrates
The Use of PTFE Base Materials
Hybrid Multilayer
High Frequency Test Methods

Taconic's Technical Resource Centre provides a wealth of technical information at a click of your mouse button.


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