Taconic Solution for your Radio Link Most used Taconic base materials for high performance and cost reductions: Taconic Grade Dielectric Constant TLC 3.0, 3.2 TLX 2.50, 2.55 TLP 2.17, 2.20, 2.33 TLY 2.17, 2.20, 2.33 TacLamPLUS 2.10 Heavy metal backed laminates Taconic also manufactures radio link base materials clad with thick copper, brass and aluminium for heat dissipation and grounding Please click the Taconic Grade to view and/or download detailed base material information. This information is available in the Members' Area of our home page: Detailed processing information Material Safety Data Sheets (MSDS) UL information Application Notes of Taconic base materials: Dielectric Constant Testing The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines TacLamPLUS - A Low Cost, Very Low Loss PCB Substrate for mmWave Applications A new, low loss laser-ablatable substrate for microwave circuitry Base material solutions for mmWave automotive applications A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications High Performance Economical Substrates - Myth or Reality? CL1 Very Low Profile ED Copper Foils for Minimising Passive Intermodulation Effects of Surface Finish on HF Signal Loss Using Various Substrates The Use of PTFE Base Materials Hybrid Multilayer New Base Materials for High-Speed Digital and RF Applications How PTFE can compete with the best in thermosets High Frequency Test Methods Taconic's Technical Resource Centre provides a wealth of technical information at a click of your mouse button. Back to Products Overview Corporate Homepage | ©2007 by Taconic | Update: 23/07/2008