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fastRiseTM Multilayer Non-Reinforced Prepreg
Characteristics
Low Dk enables reduced thickness of ATE boards
Low temperature alternative to thermoplastic films in military designs
Multilayer prepreg for mmWave applications
Stable Dk over temperature
Fiberglass free prepreg
Laser ablatable
Applications
Semiconductor testing
Military
mmWave antenna/automotive
Introducing fastRise(TM) Prepreg
fastRiseTM27 is designed to eliminate skew in differential transmission lines and eliminate dielectric constant fluctuations caused by fiberglass in filter and coupler applications. This low temperature thermosetting prepreg is based on ceramic, thermoset and PTFE and is ideal for use with Taconic's standard low loss laminates like TSM-29.
For applications that require low loss at high frequencies, fastRiseTM27 prepreg offers design engineers the properties needed for superior performance. The low 0.0017 Df at 40 GHz enables the production of mmWave multilayer PWBs. In addition, the low 420 F (215 ºC) lamination temperature enables sequential laminations to be performed at lower temperatures than those normally used for FEP and PFA in military constructions.
 Download PDF-File
Download Technical Article
Download Processing Information
fastRise 27 MSDS
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