HT 1.5 RF & Microwave Bonding Film Applications RF Multilayer Introducing HT 1.5 Bonding Film HT 1.5 bonding film offers several unique features which make it ideally suited as a bonding agent for producing laminated stripline and multilayer packages using Taconic laminates: Features Benefits Closely controlled melt point Predictable laminating cycle 2.35 Dielectric constant Electrical properties of the package are nearly unaffected by the presence of the bonding film Low loss properties Same as above Chemically stable Process chemistries will not affect circuit integrety Recommended bonding temperature: 425°F (220°C) Maximum bonding temperature: 450°F (235°C) Typical Values Download PDF-File Back to Products Overview Corporate Homepage | ©2007 by Taconic | Update: 08/10/2008