HyRelex RF & Microwave Laminates Characteristics Exceptionally Low Loss Low DK Excellent Peel Strength Superior High Temperature Performance Low Moisture Absorption Excellent Dimensional Stability Adhesiveless Applications Double Sided, Multilayer & Rigid Flex Circuits Telecommunications High Frequency Avionics Medical Consumer Electronics Military Automotive Introducing HyRelex HyRelex is a family of low loss, high reliability, flexible laminates and bonding materials. It is constructed with the benefits of reinforced high temperature polymer chemistry to provide excellent thermal, mechanical, electrical and moisture resistant properties. HyRelex is the best value for the high performance demands of flexible applications. The low dissipation factor, thermal stability and smooth surface profile minimize phase shift with frequency and temperature, and yields exceptional low loss circuit performance. HyRelex is ideally suited for high frequency, high temperature, and harsh environment applications. HyRelex has excellent peel strengths for the high temperature assembly and power handling requirements. HyRelex exhibits exceptional dimensional stability yielding fine feature registration. HyRelex laminates are generally ordered clad on both sides with 17 and 35 micron (1/2 and 1 oz) rolled or high elongation electrodeposited copper. HyRelex laminates exhibit flammability of V-0, with a thermal index rating (RTI) >150˚C. The materials are tested in accordance with IPC-TM 650. A certificate of conformance containing lot-specific data accompanies each shipment. Typical Values Download PDF-File Back to Products Overview Corporate Homepage | ©2007 by Taconic | Update: 08/10/2008