RF & Microwave Laminates with Heavy Metal Backing



Laminates with Heavy Metal Backing
In the microwave industry many applications require printed circuit boards (PCB's) being mounted onto thick metal casings mostly for thermal considerations. Taconic's product range encompasses laminates with heavy metal backing that exhibit superior adhesion between printed circuit board and metal. The combination of PCB and metal gives the opportunity to consolidate two assemblies thereby reducing overall manufacturing costs.

Brass, copper and aluminium backing is available in thicknesses from 0.5 mm to 6.35 mm (0.02" - 1/4"), with "metric" thicknesses being the main grades.


Metal grades for heavy metal-backed base materials

Metal Grade Thermal Conductivity Composition Standards Description
W/m*K % BS Equivalent ASTM Equivalent EN
Copper 390 99.9 Cu C101 Cu-ETP UNS11000 CW004A
Electrolytic Tough Pitch
99.85Cu C106 Cu-DHP UNS12200 CW024A
Phosphorous
Deoxidised
Brass 120 63 Cu
37 Zn
CZ108 UNS C27200 CW508L Common Brass
Aluminium 180 99.5 Al 1050 UNS A91050 AW1050A Availability
< 3mm
98.7 Al
<1.3 Si
6082 UNS A96082 AW6082 Structural Alloy
Availability
> 3mm


All Taconic dielectric grades are available with combined heavy-metal backing and 0.5 oz or 1 oz ED and RA copper cladding. Typical panel sizes are 12x18" (304 x 457 mm), for your convenience supplied burr-free and with rounded corners. A low-tack protective film ensures a defect-free surface

For power amplifier applications RF-35P and RF-60A are the main laminate grades, whereas TLX and TLY are mainly used for radio links.

Typical laminate grades are:
RF-35P-0200-CH/Al6mm "A" denoting aluminium
TLX-8-0100-RH/B0.8 mm "B" denoting brass
RF-60A-0250-CH/Cu3mm "C" denoting copper



Please contact your Taconic Customer Service Department for more details of metal cladding and laminate availability.


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