|
DK + tolerance |
Loss factor |
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Processing
Information |
Comment |
| Ceramic filled PTFE laminates |
| RF-35A2 |
3.5 +/- 0.05 |
0.0011 |
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Lowest loss 3.5 DK base material |
| RF-35 |
3.5 +/- 0.1 |
0.0018 |
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Historical volume DK 3.5 product |
| RF-35P |
3.5 +/- 0.1 |
0.0025 |
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Ultra-thin DK 3.5 base material |
| RF-30 |
3.0 +/- 0.1 |
0.0014 |
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High Volume antenna material |
| TLF |
3.4, 3.5 +/- 0.07 |
0.002 |
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Low cost DK 3.5 base material |
| RF-41, RF-43, RF-45 |
4.1, 4.3, 4.5
+/- 0.15 |
0.0038
0.0033
0.0037 |
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RF laminate with FR4 DK values |
| TRF-41, TRF-43, TRF-45 |
4.1, 4.3, 4.5
+/- 0.15 |
0.0035 |
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Low cost RF laminate with FR4 DK values |
| RF-60A |
6.15 +/- 0.25 |
0.0038 |
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High DK Material, easily fabricated |
| CER-10 |
10.0 nominal
+/- 0.50 |
0.0035 |
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High DK Material, easily fabricated |
| Woven glass reinforced PTFE laminates |
| TLA |
2.65 |
0.0012 |
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Low cost antenna laminate |
| TLC |
2.75, 3.0, 3.2 |
0.0022
0.0028
0.0030 |
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Legacy low cost RF laminate |
| TLE |
2.95 |
0.0026 |
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Thin dielectric base material for couplers |
| TLP |
2.2, 2.33 +/- 0.03 |
0.0009 |
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Low cost volume material |
| TLT |
2.45 - 2.65 +/- 0.04 |
|
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Legacy low DK base material |
| TLX |
2.45 - 2.65 +/- 0.04 |
0.0015 - 0.0021 |
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Low DK base material |
| TLY |
2.17 - 2.20 +/- 0.02 |
0.0009 |
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Military grade very low DK base material |
| High Reliability Products |
| TSM-26 |
2.6 +/- 0.05 |
0.0014 |
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High Reliability multilayer base material |
| TSM-29 |
2.94 +/- 0.05 |
0.0012 |
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High Reliability multilayer base material |
| TSM-30 |
3.0 +/- 0.05 |
0.0015 |
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High Reliability multilayer base material |
| TSM-DS |
2.85 +/- 0.05 |
0.0010 |
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Dimensionally stable low loss laminate rivals epoxy |
| Bond Plies/Prepregs |
fastrise27 |
2.7 +/- 0.1 |
0.0014 |
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Lowest loss non-reinforced prepreg |
| TPG |
3.0, 3.5 +/- 0.1 |
0.0038
0.0050 |
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Glass reinforced RF prepreg |
| TPN |
3.0 - 3.5 |
0.0026 - 0.0050 |
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Low flow glass reinforced prepreg |
| HT1.5 |
2.35 |
0.0025 |
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Thermoplastic bonding film |
| FEP |
2.0 |
0.0003 |
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Thermoplastic bonding film |
| Flexible Materials |
| fastfilm |
2.7 |
0.0012 |
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Non-reinforced thin RF material |
| Hyrelex TF-260, TF-290 |
2.6, 2.9 +/- 0.04, 0.05 |
TF-260 0.0020
TF-290 0.0028 |
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Flex-to-install materials |
| Speciality Materials |
| TacLamPLUS |
2.1 +/- 0.02 |
0.0009 |
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Ultra-thin base materials for mmWave applications |
| TacSil |
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Specialties for FPC assembly |
| Long Laminates |
2.17 - 3.5 |
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Oversizes base materials for antenna pcbs |
| Heavy Metal Backed Base Materials |
2.1 - 10 |
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For power amplifer & radio link pcbs |
| TLG |
2.87 - 3.0 |
0.0027
0.0038 |
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Ultra-thin core for digital multilayer |
| TLM (unclad) |
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Unclad Materials for gaskets, etc. |