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RF-35P High-Speed Digital, RF & Microwave Laminate
Characteristics
Thicknesses available ≥ 0.002" (0.05 mm)
Low Cost
Excellent Peel Strength
Exceptionally Low Loss
Low Moisture Absorption
Consistent Dimensional Stability
Very High Thermal Reliability
Applications
Multilayer
High Power Amplifier, TMA, TMB, LNA: for GSM, UMTS, 3G, PCS, PCN, WCDMA, TD-SCDMA, EDGE, CDMA2000
Repeater
Filter, Coupler, Splitter, Combiner, Mixer
Antenna
Passive Components
High Speed Digital Backpanels
Introducing RF-35P
RF-35P is the best choice for low cost, high volume commercial microwave and radio
frequency applications. RF-35P has excellent peel strength for 1/2 ounce and 1 ounce
copper (even in comparison to standard epoxy materials), a critical aspect whenever
rework is required. RF-35P’s Tg is over 600ºF (315ºC). RF-35P’s ultra low moisture
absorption rate and low dissipation factor minimize phase shift with frequency.
RF-35P is dimensionally stable due to the use of woven fabrics in its design.
RF-35P yields exceptional electrical, mechanical and thermal performance for high
density, multi layer microwave and high speed digital circuits. RF-35P is constructed
with all fine weave glass, yielding exceptional machining quality. RF-35P laminates
are generally ordered clad on one or both sides with 1/2, and 1 oz. electrodeposited
copper. RF-35P laminates exhibit flammability of V-0, and are tested in accordance
with IPC-TM-650. A certificate of compliance containing lot specific test data
accompanies each shipment. Please continue for a complete product listing.
 Typical Values
Download PDF-File
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