TacPreg™ TPG Family for High-Speed Digital and RF/Microwave Applications


Features and Benefits
  • Fabrication at standard PWB temperatures and pressures
  • Enables manufacture of 20+ layer PWBs
  • Dissipation factor flat over frequency, enabler for 6.25 gigabits/second highspeed digital applications
  • Meets or exceeds industry standard peel strength requirements (IPC 4101/4103) on 0.5 oz reverse treated foils
  • Enhanced stiffness over standard PTFE-based laminates

  • Property Units Typical Value Method
    Dielectric Constant
    (10GHz)
    3.0; 3.2; 3.5 IPC-TM 650 2.5.5
    Alexander Bereskin*
    Dissipation Factor
    (10GHz)
    0.0038; 0.0050; 0.005 IPC-TM 650 2.5.5.5
    Alexander Bereskin*
    Peel Strength
    1 oz reverse treated foil
    lbs 7 IPC-TM 650 2.4.8
    Moisture Absorption (%) 0.13; 0.22; 0.13 IPC-TM 650 2.6.2.1
    T300 min > 60
    *Alexander Bereskin Patents (5,083,088 and 5,187,443)




    TacPreg™ TPG35 loss chart above and TacPreg™ used to make a 20 layer back panel. Eye pattern created at 6.25 gb/s on a 20" trace using Teradyne GBX connectors.





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