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TacPreg™ Prepreg Press Cycle
Vacuum lamination is recommended
Heat rise 3 - 10 °F/min (1.5 - 5.5 °C) to 374 °F (190 °C)
(flow window 130 - 302 F° = 80 - 150 °C)
Kiss pressure 73 psi (5 bar) until package reaches 100 °F
(37 °C), then apply full pressure (450 psi = 31 bar)
Hold (cure) for 1 hour
Cool-down under pressure @ <6 °F (3 °C)/min
Innerlayer copper should be treated with an oxide or alternative treatment
TacPreg™TPG-35 filling 2 oz (70 micron) copper
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Plated through hole of 20-layer, .019" (4.8 mm) thick backplane
constructed with RF-35P and TacPreg.
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 Features and Benefits
Download TacPreg PDF-File
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