GHz Flip Chip - An Overview The drive in industry towards more and more wireless communication for various purposes increases the need for packaging for ever higher frequencies. This paper gives an overview of recent activities, presented by companies and universities, at GHz frequencies. The main topic is the chip interconnect, and GaAs flip chip specifically. The drive in industry towards more and more wireless communication for various purposes increases the need for packaging for ever higher frequencies. This paper gives an overview of recent activities, presented by companies and universities, at GHz frequencies. The main topic is the chip interconnect, and GaAs flip chip specifically. Papers are mostly concerned with chip design issues, and simulations of various structures. The coplanar chip design appears to be favored, along with non-melting bumps for interconnect. Back Download PDF Corporate Homepage | ©2007 by Taconic | Update: 08/10/2008