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Effect of Laminate Properties on Passive Intermodulation Generation
The results of experimental study of Passive Intermodulation (PIM) on Printed Circuit Board (PCB)
laminates are reported. Comparison of PIM performance of different materials has shown correlation between
the PIM level and the laminate physical properties. The effect of the line length on PIM level has been
experimentally observed. A simple model has been devised to describe the relation between the line length,
attenuation and PIM performance of the lengths of straight microstrip lines.
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