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ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
Taconic announced new fastRiseTM multilayer non-reinforced prepreg at the DesignCon 2008 show in Santa Clara, CA. A technical paper regarding this new material was presented on February 5th at DesignCon by Thomas McCarthy, PhD, Taconic's Vice President of New Business Development. The paper was co-authored with Heidi Barnes and Jose Moreira of Verigy, William Burns of Altanova Corporation, Crescencio Gutierrez of Harbor Electronics and Michael Resso of Agilent Technologies.
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