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Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures
This article discusses strategies for successful design and manufacture of microwave multilayer printed circuit boards. All aspects from pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, to Young's modulus are discussed in detail
Key words: TSM-DS, fastrise27, TSM-30, RF-35A2, stripline, pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, Young's modulus
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