|
 |
|
  |
|
|
Fusion Bonding Considerations for PTFE-based PCB Laminates
Multilayer printed circuit board laminates can be manufactured using PTFE-based materials by any of several methods. These include the use of low temperature prepreg bonding materials like the Taconic TacPreg family, higher temperature PCTFE bonding films, SpeedBoard(TM) bonding films, FEP bonding films and fusion bonding. The objective of this paper is to provide a description of the fusion bonding process and how the lamination occurs under these conditions.
 Back
Download PDF
|
|
|
|
|
|
|
