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2004, August 09
DuPont recognizes Taconic with their prestigious Plunkett Award
Taconic of Petersburgh (NY, USA) has received honors in the prestigious DuPont Plunkett Awards competition -- a competition that draws companies from around the world -- for Taconic’s innovative use of DuPont Teflon® in their TacPreg® bond-ply, a composite used in multi-layer printed circuit boards.
TacPreg® bond-ply has a dissipation factor less than 0.004 at 10 GHz yielding exceptional low loss signal integrity for high-speed digital and microwave frequency circuitry. Based on the same chemistry as Taconic laminate material, engineers can now design an electrically consistent low loss package throughout the board construction.
“It is an honor to receive this award in such good company for a product that we are very excited about,” remarked Dr. Thomas McCarthy, inventor of Taconic’s TacPreg bond-ply, and Product Development Manager for Taconic’s North American operations. “The distinguishing attribute of this patented material is the ability to laminate and cure in standard printed circuit board cycles and obtain peel strengths that meet or exceed industry standards.”
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