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2008, February 05
Taconic Announces fastRise(TM) Multilayer Non-Reinforced Prepreg at DesignCon
Taconic announced new fastRise(TM) multilayer non-reinforced prepreg at the DesignCon 2008 show in Santa Clara, CA. A technical paper regarding this new material was presented on February 5th at DesignCon by Thomas McCarthy, PhD, Taconic's Vice President of New Business Development. The paper was co-authored with Heidi Barnes and Jose Moreira of Verigy, William Burns of Altanova Corporation, Crescencio Gutierrez of Harbor Electronics and Michael Resso of Agilent Technologies.
ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
 Download Article PDF
Download Presentation PDF
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