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2010, July 01
Taconic Announces TacLamPLUS for mmWave Applications
• >40GHz no packaged MMICs
• Designers need to use MMIC die and wire-bonds
• Dies need to be placed in cavities to keep wires short as possible
• Substrate losses need to be the lowest
Taclamplus is a cost-effective, non-reinforced microwave substrate of typically 100 micron thickness that can be used to create very low-loss structures both with single dielectric layers and multiple layers.
Exceptional copper-foil adhesion allows small-feature resolution. It's unique composition of the dielectric, basically the absence of any glass in the substrate material, facilitates clean laser ablation for micro-via and component-cavity formation.
The use of metal-plate such as 1 mm copper helps maintain dimensional stability and provides a sound ground plane and heat-sink.
| TacLamPLUS TYPICAL VALUES |
| PROPERTY |
UNITS |
VALUE |
Dielectric Constant
@ 50 GHz |
|
2.10 |
Dissipation Factor
@ 50 GHz |
|
0.0008 |
Insertion Loss
@ 50 GHz |
dB/mm |
0.04 |
|
* Source: EADS Project Report 2002; PROKOSMOS.
Photograph depicting a 60 GHz front end module including WR-15 waveguide transition (top), IF and LO ports (SMA-connectors), biasing (left), and a integrated 60 GHz front-end including x8, mixer, and LNA (center) in Taclamplus. All designed at Chalmers University of Technology, Göteborg, Sweden
(photographs courtesy of Varioprint AG)
 TacLamPLUS
Download Data Sheet
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