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2011 August 30
Taconic introduces Tac-LED-3D - a formable IMS substrate
Tac-LED-3D is an innovative IMS substrate based on ceramic filled fluorpolymer thermoplastic resin chemistry.
For lowest thermal impedance 85 micron (0.00335") is an ideal thickness on aluminium or copper backing. With Tac-LED-3D not being brittle, it can be formed after the SMT process into 3D structures. This opens up a variety of new applications where typical epoxy based substrates have serious limitations.
| Tac-LED-3D TYPICAL VALUES |
| Characteristic |
Tac-LED-3D |
Unit |
| Dielectric Breakdown |
>3 |
kV |
| Thermal Impedance |
0.13 |
℃in²/W |
| Moisture Absorption |
<0.05 |
% |
| Copper Peel Strength (1 oz) |
11 |
lbs/in |
|
 Tac-LED-3D
Tac-LED-3D data sheet
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