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Taconic Laminates are Bromine-free |
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Regulations introduced in Europe are driving E&E OEM's to move towards non-bromine containing base materials
and prepregs to produce printed circuit boards, although the regulations do not actually ban the FR4 materials.
A review of the regulations indicates that they do not constitute a ban of all materials that can be chemically
classified as containing a "halogen" in its broadest sense, but a move towards "bromine-free". PTFE based
materials are not included in any current or future regulatory guidelines or bans. The outstanding characteristics
of PTFE including thermal stability, flame resistance, electrical properties and durability of electrical
properties render this plastic as the top candidate for printed circuit boards.
[more...]
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TacPreg for Multilayer |
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Taconic has developed a low loss bond ply material named TacPreg™
for multilayer circuit board applications. TacPreg has a dissipation
factor less than .004 at 10 GHz yielding exceptional low loss signal
integrity for high-speed digital and microwave frequency circuitry.
The distinguishing attribute of this patent pending material is the
ability to laminate and cure in standard printed circuit board cycles
and obtain peel strengths that meet or exceed industry standards.
Based on the same chemistry as Taconic laminate material, Engineers
can now design an electrically consistent low loss package throughout
the board construction. [more...]
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RF-35P for Multilayer |
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Taconic has developed a thin copper clad laminate material, RF-35P,
as an extension to the highly successful RF-35 product line. The new
thin core material is offered in .002” (0.05 mm), .004” (0.10 mm),
.006” (0.15 mm), .008” (0.20 mm) and other thickness. The material,
from the ORCER™ family of products, is based on an ORganic-CERamic
formulation. It was developed to provide high performance low loss
electrical functionality for the increasing packaging densities in
microwave printed circuit boards and the demand for higher
performance at > 5Gb/s data rates in high speed digital circuitry.
[more...]
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