TacPreg™ TP-32 and TP-35 for High-Speed Digital Applications


Features and Benefits
  • Fabrication at standard PWB temperatures and pressures
  • Enables manufacture of 20+ layer PWBs
  • Dissipation factor flat over frequency, enabler for 6.25 gigabits/second high speed digital applications
  • Meets or exceeds industry standard peel strength requirements (IPC 4101/4103) on 0.5 oz reverse treated foils
  • Enhanced stiffness over standard PTFE-based laminates

  • Property Units Typical Value Method
    Dielectric Constant
    (1 MHz/10GHz)
      3.20/3.19
    (TP-32)
    3.50/3.48
    (TP-35)
    IPC-TM 650 2.5.5
    Alexander Bereskin*
    Dissipation Factor
    (1 MHz/10GHz)
      0.0022/0.005 IPC-TM 650 2.5.5.5
    Alexander Bereskin*
    Peel Strength (warp)
    0.5 oz reverse treated foil
    lbs 5.6 IPC-TM 650 2.4.8
    Peel Strength (fill)
    0.5 oz reverse treated foil
    lbs 6.4 IPC-TM 650 2.4.8
    Moisture Absorption (%) 0.1 IPC-TM 650 2.6.2.1
    T260/T288 min > 600 / > 60  
    Glass Transition
    (DSC)
    (DMA)
    (°C)


    non-detectable
    128, 177
     
    *Alexander Bereskin Patents (5,083,088 and 5,187,443)




    TacPreg™ TP32 loss chart above and TacPreg™ TP32 used to make a 20 layer back panel. Eye pattern created at 6.25 gb/s on a 20" trace using Teradyne GBX connectors.





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