|
 |
|
  |
|
|
TacPreg™ High-Speed Digital Prepreg Press Cycle
Vacuum lamination is recommended
Heat rise 10 °F/min (5 °C) to 392 °F (200 °C) (flow window 176 - 302 F° = 80 - 150 °C)
Kiss pressure 73 psi (5 bar) until package reaches 248 °F (120 °C), then apply full pressure (450 psi = 31 bar)
Hold (cure) for 1 hour
Cool-down under pressure @ <6 °F (3 °C)/min
Innerlayer copper should be treated with an oxide or alternative treatment
TacPreg™ TP32 filling 2 oz (70 micron) copper
|
Plated through hole of 20-layer, .019" (4.8 mm) thick backplane
constructed with RF-35P and TacPreg™ TP32.
|
 Features and Benefits
Download PDF-File
Back to Products Overview
|
|
|
|
|
|
|
