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A Low Loss PTFE-based Bond Ply Material for Multilayer PCB Applications
Growing needs are developing for pure package high performance, low loss laminate and prepreg materials for
microwave telecommunications and high speed digital printed circuit board (PCB) applications. Polytetrafluoroethylene
(PTFE) has an over 30-year long history of meeting the needs in microwave frequency applications. PTFE-based materials
re-inforced with woven glass fabric and ceramic fillers offer the advantages of very low loss <0.004 at 10 GHz),
predictable dimensional stability and thermal reliability. A very low loss bonding ply comprised of a PTFE/woven
fiber-glass/ceramic/thermoset resin composite that can be processed at conventional PCB pressures and temperatures
has been developed.
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