|
 |
|
  |
|
|
2002, January 18
Taconic announces TWO NEW ORCER™ multilayer circuit board packaging materials
Taconic has developed a low loss bond ply material named TacPreg for multilayer circuit
board applications. TacPreg has a dissipation factor less than .004 at 10 GHz, yielding
exceptional low loss signal integrity for high-speed digital and microwave frequency
circuitry. The distinguishing attribute of this patent pending material is the ability
to laminate and cure in standard printed circuit board press cycles and obtain peel
strengths that meet or exceed industry standards. Based on the same chemistry as Taconic
laminate material, engineers can now design an electrically consistent low loss package
throughout the board construction. The TacPreg that corresponds to the RF-35P laminate
product line is designated as TP-32. It has a dielectric constant of 3.2. According to
Dr. Thomas McCarthy, Development Manager for Taconic, "TacPreg enables the manufacture
of dimensionally stable 20+layer printed wiring boards since the high temperature
PTFE-based composite shows little movement in conventional printed circuit board press
cycles". Materials are available for qualifying use. Availability of production quantity
materials is scheduled for later this year. For more information, please contact Taconic.
Taconic has also developed a thin copper clad laminate material, RF-35P, as an extension
to the highly successful RF-35 product line, previously limited to .010" (0.25 mm). The
new thin core material is offered in .002" (0.05 mm), .004" (0.10 mm), .006" (0.15 mm),
.008" (0.20 mm) and other thickness. The material, from the ORCER™ family of products, is
based on an ORganic-CER amic formulation. It was developed to provide high performance
low loss electrical functionality for the increasing packaging densities in microwave
printed circuit boards and the demand for higher performance at > 5 Gb/s data rates in
high speed digital circuitry. When measured at 10 GHz, the RF-35P has a dielectric
constant of 3.50 and a dissipation factor less than .004. The material has been
engineered to provide predictable x/y dimensional stability, a low z-axis CTE for
plated through hole reliability, and excellent copper peel strength.
Taconic manufactures TacLam, ORCER™, and TacPreg circuit board materials for microwave
frequency and high-speed digital applications.
***
For more information about this new packaging materials please contact:
In Asia: Mr. Y.M. Lim at Korea Taconic Co., telephone +82-31-704 1858
In Europe: Mr. Manfred Huschka at Taconic International Ltd., Ireland; telephone: +353-44-34080
In the USA: Mr. Robert Nurmi at Taconic, NY: telephone 518-658-3202
|
|
|
|
|
|
|
