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2002, March 25
Taconic and Teradyne Announce Joint Manufacturing Agreement
Alliance positions Taconic on the technology roadmap for high-speed digital
applications.
Taconic and Teradyne, Inc. Connection Systems Division (TCS), a leading
provider of high performance interconnect and electronic manufacturing
services today announced their agreement to co-manufacture and market
Taconic's patent-pending TacPreg™ material for large format PWB
applications at both Teradyne's La Verne, California facility and Taconic's
plants in Petersburgh, New York and Mullingar, Ireland.
This agreement takes advantage of Teradyne's unique competences in high
layer count, large format PWB fabrication and epoxy-coating," said Tom
Pursch, Vice President of Teradyne Connection Systems."In the race to deliver
more bandwidth, Teradyne's technology leadership in high-speed, high-
density interconnect, including our GbX™ and VHDM-HSD platforms, combined
with high performance PWB materials provides a complete system solution for
our customers."
Taconic Co-CEO Jim O'Keefe remarked, "this alliance with Teradyne allows
Taconic to rapidly translate its substantial microwave laminate position into a
visible location on the technology roadmap for high-speed digital applications.
TacPreg™ enables the manufacture of dimensionally stable 20+layer printed
wiring boards since the high temperature PTFE/ceramic composite shows little
movement at conventional printed circuit board press cycles."
TacPreg™ has a dissipation factor less than .005 at 10 GHz yielding
exceptional low loss signal integrity for high-speed digital circuitry. The
distinguishing attribute of this patent-pending material is the ability to
laminate and cure in standard printed circuit board cycles and obtain peel
strengths that meet or exceed industry standards. Based on the same
chemistry as Taconic laminate material, engineers can now design an
electrically consistent low loss pure package throughout the board
construction.
Taconic manufactures TacLam, ORCER™, and TacPreg™ circuit board
materials for microwave frequency and high-speed digital applications. The
product offerings range in dielectric constants from 2.17 to 10.
Laminate lengths up to 106” (2.7m) are supplied.
***
For more information about this new packaging materials please contact:
In Asia: Mr. Y.M. Lim at Korea Taconic Co., telephone +82-31-704 1858
In Europe: Mr. Manfred Huschka at Taconic International Ltd., Ireland;
telephone: +353-44-34080,
In the USA: Mr. Robert Nurmi at Taconic, NY: telephone 518-658-3202
Teradyne Connection Systems (TCS), a division of Boston-based Teradyne,
Inc. (NYSE: TER), provides high performance system solutions to industry
leading OEMs, with printed circuit boards, high-speed, high-density
connectors, multi-gigabit backplane assemblies and complete systems
integration and test. Teradyne's high-technology components and electronic
manufacturing services are used by manufacturers of communications and
computing systems central to building networking infrastructure.
TCS manufactures in North America, Ireland, Mexico and China. For more
information visit http://www.teradyne.com/tcs.
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