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2003, June 09
Taconic Expands Bonding Material Offering
TACONIC has added a new low-loss bond ply material to its TacPreg product
line for multilayer circuit board applications. TacPreg has a dissipation
factor less than .004 at 10 GHz yielding exceptional low loss signal
integrity for high-speed digital and microwave frequency circuitry.
The distinguishing attribute of this patented material is the ability to
laminate and cure in standard printed circuit board cycles and obtain peel
strengths that meet or exceed industry standards. Based on the same
chemistry as TACONIC laminate material, Engineers can now design an
electrically consistent low loss package throughout the board construction.
The TacPreg that corresponds to the RF-35P laminate product line is
designated as TP-35. It has a dielectric constant of 3.5. It joins TP-32,
TACONIC’s existing bondply material most commonly used as a bondply with
TacLam TL-32 for digital applications or TLC-32 for microwave applications.
According to Dr. Thomas McCarthy, TacPreg Product Manager for TACONIC,
"Adding a DK 3.5 material to our existing DK 3.2 material makes designers’
lives easier and allows them to create multilayer applications with no concern
about impedance mismatch."
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